Antibacterial Copper Nanoparticle-Loaded Hydrogel: Next-Generation Therapy for Infected Burn Wounds with pH-controlled Release

This project targets burn wound infections, often worsened by antibiotic resistance, by combining antibacterial copper nanoparticles (CuNPs) with a pH-responsive albumin hydrogel. The hydrogel provides painless application, protection, and controlled CuNP release in alkaline environments typical of infections. CuNPs offer antimicrobial effects and promote healing by supporting collagen and elastin production. Techniques like QCM-D and AFM will analyze swelling, release kinetics, and mechanical properties, with additional characterization using SEM, FTIR, and Zetasizer. This innovative system leverages copper’s therapeutic properties to combat antibiotic resistance and enhance infected burn wound treatment.